WORLD TRADE
WT/MIN(96)/16
13 December 1996
ORGANIZATION
(96-5438)
MINISTERIAL CONFERENCE
Singapore, 9-13 December 1996
MINISTERIAL DECLARATION ON TRADE IN
INFORMATION TECHNOLOGY PRODUCTS
SINGAPORE, 13 DECEMBER 1996
Ministers,
Representing
the following Members of the World Trade Organization (“WTO”), and States
or separate customs territories in the process of acceding to the WTO, which have agreed in Singapore
on the expansion of world trade in information technology products and which account for well over
80 per cent of world trade in these products ("parties"):
Australia
Norway
Canada
Separate Customs Territory of Taiwan,
European Communities
Penghu, Kinmen and Matsu
Hong Kong
Singapore
Iceland
Switzerland
1
Indonesia
Turkey
Japan
United States
Korea
Considering
the key role of trade in information technology products in the development of
information industries and in the dynamic expansion of the world economy,
Recognizing
the goals of raising standards of living and expanding the production of and trade
in goods;
Desiring
to achieve maximum freedom of world trade in information technology products;
Desiring
to encourage the continued technological development of the information technology
industry on a world-wide basis;
Mindful
of the positive contribution information technology makes to global economic growth
and welfare;
1
On behalf of the customs union Switzerland and Liechtenstein.

WT/MIN(96)/16
Page 2
Having agreed
to put into effect the results of these negotiations which involve concessions
additional to those included in the Schedules attached to the Marrakesh Protocol to the General Agreement
on Tariffs and Trade 1994, and
Recognizing
that the results of these negotiations also involve some concessions offered in
negotiations leading to the establishment of Schedules annexed to the Marrakesh Protocol,
Declare
as follows:
1.
Each party's trade regime should evolve in a manner that enhances market access opportunities
for information technology products.
2.
Pursuant to the modalities set forth in the Annex to this Declaration, each party shall bind and
eliminate customs duties and other duties and charges of any kind, within the meaning of Article II:1(b)
of the General Agreement on Tariffs and Trade 1994, with respect to the following:
(a)
allproducts classified(or classifiable) with HarmonizedSystem (1996) (“HS”) headings
listed in Attachment A to the Annex to this Declaration; and
(b)
all products specified in Attachment B to the Annex to this Declaration, whether or
not they are included in Attachment A;
through equal rate reductions of customs duties beginning in 1997 and concluding in 2000, recognizing
that extended staging of reductions and, before implementation, expansion of product coverage may
be necessary in limited circumstances.
3.
Ministers express satisfaction about the large product coverage outlined in the Attachments
to the Annex to this Declaration. They instruct their respective officials to make good faith efforts
to finalize plurilateral technical discussions in Geneva on the basis of these modalities, and instruct
these officials to complete this work by 31 January 1997, so as to ensure the implementation of this
Declaration by the largest number of participants.
4.
Ministers invite the Ministers of other Members of the WTO, and States or separate customs
territories in the process of acceding to the WTO, to provide similar instructions to their respective
officials, so that they may participate in the technical discussions referred to in paragraph 3 above and
participate fully in the expansion of world trade in information technology products.
Annex:
Modalities and Product Coverage
Attachment A: list of HS headings
Attachment B: list of products

WT/MIN(96)/16
Page 3
ANNEX
Modalities and Product Coverage
Any Member of the World Trade Organization, or State or separate customs territory in the
process of acceding to the WTO, may participate in the expansion of world trade in information
technology products in accordance with the following modalities:
1.
Each participant shall incorporate the measures described in paragraph 2 of the Declaration
into its schedule to the General Agreement on Tariffs and Trade 1994, and, in addition, at either its
own tariff line level or the Harmonized System (1996) (“HS”) 6-digit level in either its official tariff
or any other published versions of the tariff schedule, whichever is ordinarily used by importers and
exporters. Each participant that is not a Member of the WTO shall implement these measures on an
autonomous basis, pending completion of its WTO accession, and shall incorporate these measures
into its WTO market access schedule for goods.
2.
To this end, as early as possible and no later than 1 March 1997 each participant shall provide
all other participants a document containing (a) the details concerning how the appropriate duty treatment
will be provided in its WTO schedule of concessions, and (b) a list of the detailed HS headings involved
for products specified in Attachment B. These documents will be reviewed and approved on a consensus
basis and this review process shall be completed no later than 1 April 1997. As soon as this review
process has been completed for any such document, that document shall be submitted as a modification
to the Schedule of the participant concerned, in accordance with the Decision of 26 March 1980 on
Procedures for Modification and Rectification of Schedules of Tariff Concessions (BISD 27S/25) .
(a)
The concessions to be proposed by each participant as modifications to its Schedule
shall bind and eliminate all customs duties and other duties and charges of any kind
on information technology products as follows:
(i)
elimination of such customs duties shall take place through rate reductions in
equal steps, except as may be otherwise agreed by the participants. Unless
otherwise agreed by the participants, each participant shall bind all tariffs on
items listed in the Attachments no later than 1 July 1997, and shall make the
first such rate reduction effective no later than 1 July 1997, the second such
rate reduction no later than 1 January 1998, and the third such rate reduction
no later than 1 January 1999, and the elimination of customs duties shall be
completed effective no later than 1 January 2000. The participants agree to
encourage autonomous elimination of customs duties prior to these dates. The
reduced rate should in each stage be rounded off to the first decimal; and
(ii)
elimination of such other duties and charges of any kind, within the meaning
of Article II:1(b) of the General Agreement, shall be completed by 1 July 1997,
except as may be otherwise specified in the participant’s document provided
to other participants for review.
(b)
The modifications to its Schedule to be proposed by a participant in order to implement
its binding and elimination of customs duties on information technology products shall
achieve this result:
(i)
in the case of the HS headings listed in Attachment A, by creating
,
where
appropriate
,
sub-divisions in its Schedule at the national tariff line level; and

WT/MIN(96)/16
Page 4
(ii)
in the case of the products specified in Attachment B, by attaching an annex
to its Schedule including all products in Attachment B, which is to specify the
detailed HS headings for those products at either the national tariff line level
or the HS 6-digit level.
Each participant shall promptly modify its national tariff schedule to reflect the modifications
it has proposed, as soon as they have entered into effect.
3.
Participants shall meet periodically under the auspices of the Council on Trade in Goods to
review the product coverage specified in the Attachments, with a view to agreeing, by consensus, whether
in the light of technological developments, experience in applying the tariff concessions, or changes
to the HS nomenclature, the Attachments should be modified to incorporate additional products, and
to consult on non-tariff barriers to trade in information technology products. Such consultations shall
be without prejudice to rights and obligations under the WTO Agreement.
4.
Participants shall meet as soon as practicable and in any case no later than 1 April 1997 to
review the state of acceptances received and to assess the conclusions to be drawn therefrom.
Participants will implement the actions foreseen in the Declaration provided that participants representing
approximately 90 per cent of world trade
2
in information technology products have by then notified
their acceptance, and provided that the staging has been agreed to the participants’ satisfaction. In
assessing whether to implement actions foreseen in the Declaration, if the percentage of world trade
represented by participants falls somewhat short of 90 per cent of world trade in information technology
products, participants may take into account the extent of the participation of States or separate customs
territories representing for them the substantial bulk of their own trade in such products. At this meeting
the participants will establish whether these criteria have been met.
5.
Participants shall meet as often as necessary and no later than 30 September 1997 to consider
any divergence among them in classifying information technology products, beginning with the products
specified in Attachment B. Participants agree on the common objective of achieving, where appropriate,
a common classification for these products within existing HS nomenclature, giving consideration to
interpretations and rulings of the Customs Co-operation Council (also known as the World Customs
Organization or “WCO”) . In any instance in which a divergence in classification remains, participants
will consider whether a joint suggestion could be made to the WCO with regard to updating existing
HS nomenclature or resolving divergence in interpretation of the HS nomenclature.
6.
The participants understand that Article XXIII of the General Agreement will address nullification
or impairment of benefits accruing directly or indirectly to a WTO Member participant through the
implementation of this Declaration as a result of the application by another WTO Member participant
of any measure, whether or not that measure conflicts with the provisions of the General Agreement.
7.
Each participant shall afford sympathetic consideration to any request for consultation from
any other participant concerning the undertakings set out above. Such consultations shall be without
prejudice to rights and obligations under the WTO Agreement.
8.
Participants acting under the auspices of the Council for Trade in Goods shall inform other
Members of the WTO and States or separate customs territories in the process of acceding to the WTO
of these modalities and initiate consultations with a view to facilitate their participation in the expansion
of trade in information technology products on the basis of the Declaration.
2
This percentage shall be calculated by the WTO Secretariat on the basis of the most recent data available
at the time of the meeting.

WT/MIN(96)/16
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9.
As used in these modalities, the term "participant" shall mean those Members of the WTO,
or States or separate customs territories in the process of acceding to the WTO, that provide the document
described in paragraph 2 no later than 1 March 1997.
10.
This Annex shall be open for acceptance by all Members of the WTO and any State or any
separate customs territory in the process of acceding to the WTO. Acceptances shall be notified in
writing to the Director-General who shall communicate them to all participants.

WT/MIN(96)/16
Page 6
There are two attachments to the Annex.
Attachment A lists the HS headings or parts thereof to be covered.
Attachment B lists specific products to be covered by an ITA wherever they are classified in the
HS .
Attachment A, Section 1
HS96
HS description
3818
Chemical elements doped for use in electronics, in form of discs, wafers or similar
forms; chemical compounds doped for use in electronics
8469
11
Word processing machines
8470
Calculating machines and pocket-size data recording, reproducing and displaying
machines with a calculating function; accounting machines, postage franking machines,
ticket-issuing machines and similar machines, incorporating a calculating devices; cash
registers:
8470
10
Electronic calculators capable of operating without an external source of electric power and
pocket size data recording, reproducing and displaying machines with calculating functions
8470
21
Other electronic calculating machines incorporating a printing device
8470
29
Other
8470
30
Other calculating machines
8470
40
Accounting machines
8470
50
Cash registers
8470
90
Other
8471
Automatic data processing machines and units thereof; magnetic or optical readers,
machines for transcribing data onto data media in coded form and machines for
processing such data, not elsewhere specified or included:
8471
10
Analogue or hybrid automatic data processing machines
8471
30
Portable digital automatic data processing machines, weighing no more than 10 kg,
consisting of at least a central processing unit, a keyboard and a display
8471
41
Other digital automatic data processing machines comprising in the same housing at least a
central processing unit and an input and output unit, whether or not combined
8471
49
Other digital automatic data processing machines presented in the form of systems
8471
50
Digital processing units other than those of subheading 8471 41 and 8471 49, whether or
not in the same housing one or two of the following types of units : storage units, input
units, output units
8471
60
Input or output units, whether or not containing storage units in the same housing
8471
70
Storage units, including central storage units, optical disk storage units, hard disk drives and
magnetic tape storage units
8471
80
Other units of automatic data processing machines
8471
90
Other
ex
8472
90
Automatic teller machines
8473
21
Parts and accessories of the machines of heading No 8470 of the electronic calculating
machines of subheading 8470 10, 8470 21 and 8470 29
8473
29
Parts and accessories of the machines of heading No 8470 other than the electronic
calculating machines of subheading 8470 10, 8470 21 and 8470 29
8473
30
Parts and accessories of the machines of heading No 8471

WT/MIN(96)/16
Page 7
8473
50
Parts and accessories equally suitable for use with machines of two or more of the
headings Nos. 8469 to 8472
ex
8504
40
Static converters for automatic data processing machines and units thereof, and
telecommunication apparatus
ex
8504
50
Other inductors for power supplies for automatic data processing machines and units
thereof, and telecommunication apparatus
8517
Electrical apparatus for line telephony or line telegraphy, including line telephone sets
with cordless handsets and telecommunication apparatus for carrier-current line
systems or for digital line systems; videophones:
8517
11
Line telephone sets with cordless handsets
8517
19
Other telephone sets and videophones
8517
21
Facsimile machines
8517
22
Teleprinters
8517
30
Telephonic or telegraphic switching apparatus
8517
50
Other apparatus, for carrier-current line systems or for digital line systems
8517
80
Other apparatus including entry-phone systems
8517
90
Parts of apparatus of heading 8517
ex
8518
10
Microphones having a frequency range of 300 Hz to 3,4 KHz with a diameter of not
exceeding 10 mm and a height not exceeding 3 mm, for telecommunication use
ex
8518
30
Line telephone handsets
ex
8518
29
Loudspeakers, without housing, having a frequency range of 300 Hz to 3,4 KHz with a
diameter of not exceeding 50 mm, for telecommunication use
8520
20
Telephone answering machines
8523
11
Magnetic tapes of a width not exceeding 4 mm
8523
12
Magnetic tapes of a width exceeding 4 mm but not exceeding 6,5 mm
8523
13
Magnetic tapes of a width exceeding 6,5 mm
8523
20
Magnetic discs
8523
90
Other
8524
31
Discs for laser reading systems for reproducing phenomena other than sound or image
ex
8524
39
Other :
- for reproducing representations of instructions, data, sound, and image, recorded in
a machine readable binary form, and capable of being manipulated or providing
interactivity to a user, by means of an automatic data processing machine
8524
40
Magnetic tapes for reproducing phenomena other than sound or image
8524
91
Media for reproducing phenomena other than sound or image
ex
8424
99
Other :
- for reproducing representations of instructions, data, sound, and image, recorded in
a machine readable binary form, and capable of being manipulated or providing
interactivity to a user, by means of an automatic data processing machine
ex
8525
10
Transmission apparatus other than apparatus for radio-broadcasting or television
8525
20
Transmission apparatus incorporating reception apparatus
ex
8525
40
Digital still image video cameras
ex
8527
90
Portable receivers for calling, alerting or paging
ex
8529
10
Aerials or antennae of a kind used with apparatus for radio-telephony and
radio-telegraphy

WT/MIN(96)/16
Page 8
ex
8529
90
Parts of:
transmission apparatus other than apparatus for radio-broadcasting or television
transmission apparatus incorporating reception apparatus
digital still image video cameras,
portable receivers for calling, alerting or paging
8531
20
Indicator panels incorporating liquid crystal devices (LCD) or light emitting diodes
(LED)
ex
8531
90
Parts of apparatus of subheading 8531 20
8532
Electrical capacitors, fixed, variable or adjustable (pre-set):
8532
10
Fixed capacitors designed for use in 50/60 Hz circuits and having a reactive power handling
capacity of not less than 0,5 kvar (power capacitors)
8532
21
Tantalum fixed capacitors
8532
22
Aluminium electrolytic fixed capacitors
8532
23
Ceramic dielectric, single layer fixed capacitors
8532
24
Ceramic dielectric, multilayer fixed capacitors
8532
25
Dielectric fixed capacitors of paper or plastics
8532
29
Other fixed capacitors
8532
30
Variable or adjustable (pre-set) capacitors
8532
90
Parts
8533
Electrical resistors (including rheostats and potentiometers), other than heating
resistors:
8533
10
Fixed carbon resistors, composition or film types
8533
21
Other fixed resistors for a power handling capacity not exceeding 20 W
8533
29
Other fixed resistors for a power handling capacity of 20 W or more
8533
31
Wirewound variable resistors, including rheostats and potentiometers, for a power handling
capacity not exceeding 20 W
8533
39
Wirewound variable resistors, including rheostats and potentiometers, for a power handling
capacity of 20 W or more
8533
40
Other variable resistors, including rheostats and potentiometers
8533
90
Parts
8534
Printed circuits
ex
8536
50
Electronic AC switches consisting of optically coupled input and output circuits
(Insulated thyristor AC switches)
ex
8536
50
Electronic switches, including temperature protected electronic switches, consisting of a
transistor and a logic chip (chip-on-chip technology) for a voltage not exceeding 1000
volts
ex
8536
50
Electromechanical snap-action switches for a current not exceeding 11 amps
ex
8536
69
Plugs and sockets for co-axial cables and printed circuits
ex
8536
90
Connection and contact elements for wires and cables
8541
Diodes, transistors and similar semiconductor devices; photosensitive semiconductor
devices, including photovoltaic cells whether or not assembled in modules or made up
into panels; light-emitting diodes; mounted piezo-electric crystals:
8541
10
Diodes, other than photosensitive or light-emitting diodes
8541
21
Transistors, other than photosensitive transistors, with a dissipation rate of less than 1 W
8541
29
Transistors, other than photosensitive transistors, with a dissipation rate of 1 W or more

WT/MIN(96)/16
Page 9
8541
30
Thyristors, diacs and triacs, other than photosensitive devices
8541
40
Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled
in modules or made up into panels; light emitting diodes
8541
50
Other semiconductor devices
8541
60
Mounted piezo-electric crystals
8541
90
Parts
8542
Electronic integrated circuits and microassemblies
8542
12
Cards incorporating an electronic integrated circuit ('smart' cards)
8542
13
Metal oxide semiconductors (MOS technology)
8542
14
Circuits obtained by bipolar technology
8542
19
Other monolithic digital integrated circuits, including circuits obtained by a combination of
bipolar and MOS technologies (BIMOS technology)
8542
30
Other monolithic integrated circuits
8542
40
Hybrid integrated circuits
8542
50
Electronic microassemblies
8542
90
Part
8543
81
Proximity cards and tags
ex
8543
89
Electrical machines with translation or dictionary functions
ex
8544
41
Other electric conductors, for a voltage not exceeding 80 V, fitted with connectors, of a
kind used for telecommunications
ex
8544
49
Other electric conductors, for a voltage not exceeding 80 V, not fitted with connectors,
of a kind used for telecommunications
ex
8544
51
Other electric conductors, for a voltage exceeding 80 V but not exceeding 1000 V,
fitted with connectors, of a kind used for telecommunications
8544
70
Optical fibre cables
9009
11
Electrostatic photocopying apparatus, operating by reproducing the original image
directly onto the copy (direct process)]
9009
21
Other photocopying apparatus, incorporating an optical system
9009
90
Parts and accessories
9026
Instruments and apparatus for measuring or checking the flow, level, pressure or other
variables of liquids or gases (for example, flow meters, level gauges, manometers, heat
meters), excluding instruments and apparatus of heading No 9014, 9015, 9028 or 9032:
9026
10
Instruments for measuring or checking the flow or level of liquids
9026
20
Instruments and apparatus for measuring or checking pressure
9026
80
Other instruments and apparatus for measuring or checking of heading 9026
9026
90
Parts and accessories of instruments and apparatus of heading 9026
9027
20
Chromatographs and electrophoresis instruments
9027
30
Spectrometers, spectrophotometers and spectrographs using optical radiations (UV,
visible, IR)
9027
50
Other instruments and apparatus using optical radiations (UV, visible, IR) of heading
No 9027
9027
80
Other instruments and apparatus of heading No 9027 (other than those of heading No
9027 10)
ex
9027
90
Parts and accessories of products of heading 9027, other than for gas or smoke
analysis apparatus and microtomes

WT/MIN(96)/16
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9030
40
Instruments and apparatus for measuring and checking, specially designed for
telecommunications (for example, cross-talk meters, gain measuring instruments,
distorsion factor meters, psophometers)

WT/MIN(96)/16
Page 11
Attachment A, Section 2
Semiconductor manufacturing and testing equipment and parts thereof
HS Code
Description
Comments
ex
7017 10
Quartz reactor tubes and holders designed for insertion into diffusion and
oxidation furnaces for production of semiconductor wafers
For Attachment B
ex
8419 89
Chemical vapor deposition apparatus for semiconductor production
For Attachment B
ex
8419 90
Parts of chemical vapor deposition apparatus for semiconductor
production
For Attachment B
ex
8421 19
Spin dryers for semiconductor wafer processing
ex
8421 91
Parts of spin dryers for semiconductor wafer processing
ex
8424 89
Deflash machines for cleaning and removing contaminants from the
metal leads of semiconductor packages prior to the electroplating process
ex
8424 89
Spraying appliances for etching, stripping or cleaning semiconductor
wafers
ex
8424 90
Parts of spraying appliances for etching, stripping or cleaning
semiconductor wafers
ex
8456 10
Machines for working any material by removal of material, by laser or
other light or photo beam in the production of semiconductor wafers
ex
8456 91
Apparatus for stripping or cleaning semiconductor wafers
For Attachment B
8456 91
Machines for dry-etching patterns on semiconductor materials
ex
8456 99
Focused ion beam milling machines to produce or repair masks and
reticles for patterns on semiconductor devices
ex
8456 99
Lasercutters for cutting contacting tracks in semiconductor production by
laser beam
For Attachment B
ex
8464 10
Machines for sawing monocrystal semiconductor boules into slices, or
wafers into chips
For Attachment B
ex
8464 20
Grinding, polishing and lapping machines for processing of semiconductor
wafers
ex
8464 90
Dicing machines for scribing or scoring semiconductor wafers
ex
8466 91
Parts for machines for sawing monocrystal semiconductor boules into
slices, or wafers into chips
For Attachment B
ex
8466 91
Parts of dicing machines for scribing or scoring semiconductor wafers
For Attachment B
ex
8466 91
Parts of grinding, polishing and lapping machines for processing of
semiconductor wafers
ex
8466 93
Parts of focused ion beam milling machines to produce or repair masks
and reticles for patterns on semiconductor devices
ex
8466 93
Parts of lasercutters for cutting contacting tracks in semiconductor
production by laser beam
For Attachment B
ex
8466 93
Parts of machines for working any material by removal of material, by
laser or other light or photo beam in the production of semiconductor
wafers
ex
8456 93
Parts of apparatus for stripping or cleaning semiconductor wafers
For Attachment B
ex
8466 93
Parts of machines for dry-etching patterns on semiconductor materials
ex
8477 10
Encapsulation equipment for assembly of semiconductors
For Attachment B
ex
8477 90
Parts of encapsulation equipment
For Attachment B

WT/MIN(96)/16
Page 12
ex
8479 50
Automated machines for transport, handling and storage of semiconductor
wafers, wafer cassettes, wafer boxes and other material for semiconductor
devices
For Attachment B
ex
8479 89
Apparatus for growing or pulling monocrystal semiconductor boules
ex
8479 89
Apparatus for physical deposition by sputtering on semiconductor wafers
For Attachment B
ex
8479 89
Apparatus for wet etching, developing, stripping or cleaning
semiconductor wafers and flat panel displays
For Attachment B
ex
8479 89
Die attach apparatus, tape automated bonders, and wire bonders for
assembly of semiconductors
For Attachment B
ex
8479 89
Encapsulation equipment for assembly of semiconductors
For Attachment B
ex
8479 89
Epitaxial deposition machines for semiconductor wafers
ex
8479 89
Machines for bending, folding and straightening semiconductor leads
For Attachment B
ex
8479 89
Physical deposition apparatus for for semiconductor production
For Attachment B
ex
8479 89
Spinners for coating photographic emulsions on semiconductor wafers
For Attachment B
ex
8479 90
Part of apparatus for physical deposition by sputtering on semiconductor
wafers
For Attachment B
ex
8479 90
Parts for die attach apparatus, tape automated bonders, and wire bonders
for assembly of semiconductors
For Attachment B
ex
8479 90
Parts for spinners for coating photographic emulsions on semiconductor
wafers
For Attachment B
ex
8479 90
Parts of apparatus for growing or pulling monocrystal semiconductor
boules
ex
8479 90
Parts of apparatus for wet etching, developing, stripping or cleaning
semiconductor wafers and flat panel displays
For Attachment B
ex
8479 90
Parts of automated machines for transport, handling and storage of
semiconductor wafers, wafer cassettes, wafer boxes and other material for
semiconductor devices
For Attachment B
ex
8479 90
Parts of encapsulation equipment for assembly of semiconductors
For Attachment B
ex
8479 90
Parts of epitaxial deposition machines for semiconductor wafers
ex
8479 90
Parts of machines for bending, folding and straightening semiconductor
leads
For Attachment B
ex
8479 90
Parts of physical deposition apparatus for for semiconductor production
For Attachment B
ex
8480 71
Injection and compression moulds for the manufacture of semiconductor
devices
ex
8514 10
Resistance heated furnaces and ovens for the manufacture of
semiconductor devices on semiconductor wafers
ex
8514 20
Inductance or dielectric furnaces and ovens for the manufacture of
semiconductor devices on semiconductors wafers
ex
8514 30
Apparatus for rapid heating of semiconductor wafers
For Attachment B
ex
8514 30
Parts of resistance heated furnaces and ovens for the manufacture of
semiconductor devices on semiconductor wafers
ex
8514 90
Parts of apparatus for rapid heating of wafers
For Attachment B
ex
8514 90
Parts of furnaces and ovens of Headings No 8514 10 to No 8514 30
ex
8536 90
Wafer probers
For Attachment B
8543 11
Ion implanters for doping semiconductor materials
ex
8543 30
Apparatus for wet etching, developing, stripping or cleaning
semiconductor wafers and flat panel displays
For Attachment B

WT/MIN(96)/16
Page 13
ex
8543 90
Parts of apparatus for wet etching, developing, stripping or cleaning
semiconductor wafers and flat panel displays
For Attachment B
ex
8543 90
Parts of ion implanters for doping semiconductor materials
9010 41 to
9010 49
Apparatus for projection, drawing or plating circuit patterns on sensitized
semiconductor materials and flat panel displays
ex
9010 90
Parts and accessories of the apparatus of Headings No 9010 41 to 9010 49
ex
9011 10
Optical stereoscopic microscopes fitted with equipment specifically
designed for the handling and transport of semiconductor wafers or
reticles
For Attachment B
ex
9011 20
Photomicrographic microscopes fitted with equipment specifically
designed for the handling and transport of semiconductor wafers or
reticles
For Attachment B
ex
9011 90
Parts and accessories of optical stereoscopic microscopes fitted with
equipment specifically designed for the handling and transport of
semiconductor wafers or reticles
For Attachment B
ex
9011 90
Parts and accessories of photomicrographic microscopes fitted with
equipment specifically designed for the handling and transport of
semiconductor wafers or reticles
For Attachment B
ex
9012 10
Electron beam microscopes fitted with equipment specifically designed for
the handling and transport of semiconductor wafers or reticles
For Attachment B
ex
9012 90
Parts and accessories of electron beam microscopes fitted with equipment
specifically designed for the handling and transport of semiconductor
wafers or reticles
For Attachment B
ex
9017 20
Pattern generating apparatus of a kind used for producing masks or
reticles from photoresist coated substrates
For Attachment B
ex
9017 90
Parts and accessories for pattern generating apparatus of a kind used for
producing masks or reticles from photoresist coated substrates
For Attachment B
ex
9017 90
Parts of such pattern generating apparatus
For Attachment B
9030 82
Instruments and apparatus for measuring or checking semiconductor
wafers or devices
ex
9030 90
Parts and accessories of instruments and apparatus for measuring or
checking semiconductor wafers or devices
ex
9030 90
Parts of instruments and appliances for measuring or checking
semiconductor wafers or devices
9031 41
Optical instruments and appliances for inspecting semiconductor wafers
or devices or for inspecting masks, photomasks or reticles used in
manufacturing semiconductor devices
ex
9031 49
Optical instruments and appliances for measuring surface particulate
contamination on semiconductor wafers
ex
9031 90
Parts and accessories of optical instruments and appliances for inspecting
semiconductor wafers or devices or for inspecting masks, photomasks or
reticles used in manufacturing semiconductor devices
ex
9031 90
Parts and accessories of optical instruments and appliances for measuring
surface particulate contamination on semiconductor wafers

WT/MIN(96)/16
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Attachment B
Positive list of specific products to be covered by this agreement wherever they are
classified in the HS.
Where parts are specified, they are to be covered in accordance with HS Notes 2(b) to
Section XVI and Chapter 90, respectively.
Computers:
automatic data processing machines capable of 1) storing the processing program or programs and at
least the data immediately necessary for the execution of the program; 2) being freely programmed in accordance
with the requirements of the user; 3) performing arithmetical computations specified by the user; and 4) executing,
without human intervention, a processing program which requires them to modify their execution, by logical
decision during the processing run.
The agreement covers such automatic data processing machines whether or not they are able to receive and process
with the assistance of central processing unit telephony signals, television signals, or other analogue or digitally
processed audio or video signals. Machines performing a specific function other than data processing, or
incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified
under Attachment A or B, are not covered by this agreement.
Electric amplifiers
when used as repeaters in line telephony products falling within this agreement, and parts
thereof
Flat panel displays
(including LCD, Electro Luminescence, Plasma and other technologies) for products falling
within this agreement, and parts thereof.
Network equipment:
Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those
products dedicated for use solely or principally to permit the interconnection of automatic data processing machines
and units thereof for a network that is used primarily for the sharing of resources such as central processor units,
data storage devices and input or output units - including adapters, hubs, in-line repeaters, converters, concentrators,
bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing
machines and units thereof.
Monitors :
display units of automatic data processing machines with a cathode ray tube with a dot screen pitch
smaller than 0,4 mm not capable of receiving and processing television signals or other analogue or digitally
processed audio or video signals without assistance of a central processing unit of a computer as defined in this
agreement.
The agreement does not, therefore, cover televisions, including high definition televisions.
3
Optical disc storage units,
for automatic data processing machines (including CD drives and DVD-drives), whether
or not having the capability of writing/recording as well as reading, whether or not in their own housings.
Paging alert devices
, and parts thereof .
Plotters
whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No
9017.
Printed Circuit Assemblies
for products falling within this agreement, including such assemblies for external
connections such as cards that conform to the PCMCIA standard.
Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active
elements assembled thereon, with or without passive elements "Active elements" means diodes, transistors, and
similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro
assemblies of heading 8542.
Projection type flat panel display units
used with automatic data processing machines which can display digital
information generated by the central processing unit.
3
Participants will conduct a review of this product description in January 1999 under the consultation
provisions of paragraph 3 of the Declaration

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Proprietary format storage devices
including media therefor for automatic data processing machines, with or
without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or
Zipdrive cartridge storage units.
Multimedia upgrade kits
for automatic data processing machines, and units thereof, put up for retail sale,
consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the ADP
machines and units thereof to process audio signals (sound cards) .
Set top boxes which have a communication function
: a microprocessor-based device incorporating a modem for
gaining access to the Internet, and having a function of interactive information exchange